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T-Mobile REVVL 4+ - description and parameters

T-Mobile REVVL 4+ supports frequency bands GSM , HSPA , LTE. Official announcement date is August 27 2020. The device is working on an Android 10 with a Octa-core (4x2.0 GHz Kryo 260 Gold & 4x1.8 GHz Kryo 260 Silver) processor. T-Mobile REVVL 4+ has 64GB 4GB RAM of built-in memory. This device has a Qualcomm SDM665 Snapdragon 665 (11 nm) chipset. The main screen size is 6.52 inches, 109.7 cm2 with 720 x 1440 pixels, 18:9 ratio resolution. It has a 247 ppi density) ppi pixel density. The screen covers about 88.2% of the device's body. This screen to body ratio is a very impressive

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Network, supported bands and technologies TechnologyGSM / HSPA / LTE
2G bandsGSM 850 / 900 / 1800 / 1900
3G bandsHSDPA 850 / 1700(AWS) / 1900
4G bands1, 2, 3, 4, 5, 7, 8, 12, 13, 20, 25, 26, 28, 38, 39, 40, 41, 66, 71
SpeedHSPA 42.2/5.76 Mbps, LTE
Release date First presented2020, August 27
StatusAvailable. Released 2020, September 04
Size and Dimensions Measurements165.4 x 75.2 x 8.1 mm (6.51 x 2.96 x 0.32 in)
Weight180 g (6.35 oz)
SIMNano-SIM
Display (type and size) TypeIPS LCD
Size6.52 inches, 109.7 cm2
Resolution720 x 1440 pixels, 18:9 ratio
System and processor information OSAndroid 10
ChipsetQualcomm SDM665 Snapdragon 665 (11 nm)
Central processing unitOcta-core (4x2.0 GHz Kryo 260 Gold & 4x1.8 GHz Kryo 260 Silver)
Graphics processing unitAdreno 610
Memory bank Slot for memory cardmicroSDXC
Built-in64GB 4GB RAM
 "eMMC 5.1
Camera Dual16 MP, PDAF5 MP
FeaturesDual-LED dual-tone flash, HDR, panorama
Video1080p@30fps
Selfie Single16 MP
Selfie Video1080p@30fps
Sound Main speakerYes
3.5mm jackYes
Communication WLANWi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth5.0, A2DP, LE
GPSYes, with A-GPS
NFCYes
RadioNo
USBUSB Type-C 2.0
Features SensorsFingerprint recognition (rear-mounted), accelerometer, proximity sensor
Battery TypeLi-Ion 4000 mAh, non-removable
Other ColorsSteel Gray
PriceAbout 190 USD

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